Keeprecision -110-BR ist W?rmeschutzmaterial für die unterschiedlichsten Industrien und Anwendungsbereicheden

Keeprecision-120-BL is an engineering composite material made from fibre-reinforced plastics, mainly used as a high-quality insulation material in the mould industry.

Keeprecision-200-BU is an engineering composite material made from fibre-reinforced plastics, mainly used as a high-quality insulation material in the mould industry.

Keeprecision-200-GR is an engineering composite material made from fibre-reinforced plastics, mainly used as a high-quality insulation material in the mould industry.

Keeprecision-200-WH is an engineering composite material made from fibre-reinforced plastics, used as a high-quality insulation material in the mould industry.

Keeprecision-200-YE is an engineering composite material made from fibre-reinforced plastics, mainly used as a high-quality insulation material in the mould industry.

Keeprecision-220-BR is an engineering composite material made from fibre-reinforced plastics, mainly used as a high-quality insulation material in the mould industry.

Keeprecision-220-YE is an engineering composite material made from fibre-reinforced plastics, mainly used as a high-quality insulation material in the mould industry.

Keeprecision-250-BL is an engineering composite material made from fibre-reinforced plastics, mainly used as a high-quality insulation material in the mould industry.

Keeprecision-250-BR is an engineering composite material made from fibre-reinforced plastics, mainly used as a high-quality insulation material in the mould industry.

Keeprecision-250-GN is an engineering composite material made from fibre-reinforced plastics, mainly used as a high-quality insulation material in the mould industry.

Keeprecision-250-RD is an engineering composite material made from fibre-reinforced plastics, mainly used as a high-quality insulation material in the mould industry.

Keeprecision-280-GN is an engineering composite material made from fibre-reinforced plastics, mainly used as a high-quality insulation material in the mould industry.

Keeprecision-280-WH is an engineering composite material made from fibre-reinforced plastics, mainly used as a high-quality insulation material in the mould industry.

Keeprecision-310-BL is an engineering composite material made from fibre-reinforced plastics, mainly used as a high-quality insulation material in the mould industry.

Keeprecision-310-BU is an engineering composite material made from fibre-reinforced plastics, mainly used as a high-quality insulation material in the mould industry.

Keeprecision-600-SL is an engineering inorganic composite material, mainly used as a high-quality thermal insulation material in the mould industry.

Keeprecision-700-GR is an engineering composite inorganic material mainly used as a high-quality insulation material in the mould industry.

Keeprecision-800-GD is an engineering composite inorganic material, mainly used as a high-quality insulation material in the mould industry.

Keeprecision-1100-WH is an engineering composite inorganic material, mainly used as a high-quality insulation material in the mould industry.

Keeprecision-1200-SL is an engineered composite inorganic material, mainly used as a high-quality insulation material in the industry.

Keeprecision-200-GN is an engineering composite material made from fibre-reinforced plastics, mainly used as a high-quality insulation material in the mould industry.

Keeprecision-1300-GR is high temperature resistant ceramics made from Silicon Nitride, featureing good corrosion resistance, relatively high application temperature(1300°C) and low thermal conductivity.

Keeprecision-1600-WH is a high-temp. resistant ceramic material made from alumina (95%~99%), featuring electrical insulation, excellent corrosion resistance, mechanical strength and wear resistance.

Keeprecision-400-SL is an engineering composite material made from mineral wool and exterior organic cloth, mainly used as a high-quality industrial thermal insulation material (e.g. Insulation for IC encapsulation).